The main difference between SOIC8 and SO8 manufacturing is the width of the leads from the IC itself. SO8 has a little larger footprint per pin than SOIC8, but with similar pin gap space per row, they fit the same board configuration.
SOIC stands for surface mount integrated circuit package. A flat rectangular body with leads protruding from two sides is the conventional form. The leads are shaped like gull wings to ensure a secure footing during installation to a PCB. Matte Tin plating is the standard Pb-free lead finish on these products.
Comparison Between SO 8 and SOIC 8
SOIC has ultra-high-density vertical stacking for excellent performance, low power consumption, and low RLC (resistance-inductance-capacitance). SO 8 is an emerging microelectronic technology that places an entire system on a single chip-size package.
The encapsulation of one or more CPUs, microcontrollers, other accelerators, and multifunctional circuits into a single package is referred to as SO 8. The term system on a chip refers to the integration of one or more CPUs, microcontrollers, DSPs, other accelerators, or supporting hardware into a single chip.
Is SO 8 and SOIC 8 the Same?
On SOIC packages, each pin is typically separated by roughly 0.05″ (1.27mm). The SO is a scaled-down version of the SOIC package. TSOP (thin small-outline package) and TSSOP (thin-shrink small-outline package) are two other IC packages that are similar.
Overall, a SOIC8 would fit an SO8 sitting plane since the pins would have modest spare spacing on either side per pin. An SO8 may have the pins somewhat going over the lead pattern edge for a SOIC8 lead plane when using an absolute board printing layout seating plane per chip type. These are measured in millimeters.
What Is the Difference Between SOP and SOIC
SOIC is another name for SOP. JEDEC standards are termed SOIC in the United States, and JEITA standards are named SOP in Japan, with the former having a wider body width than the latter. It was created to take up less area on the substrate than DIP (Dual in-line package).
SOP cuts DIP’s lead interval in half and increases the lead for surface mounting to the exterior Gull’s wing form (Gull Wing). SOIC was designed to take up less area on the substrate than DIP. The lead exits from both sides and winds around the length of the package, securing the package body with the tips.
What Does SOIC Mean in Electronics
A tiny outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package. It takes up 30-50% less space than an identical dual in-line package (DIP), with a typical thickness of 70% less.
SOIC is available in a variety of 8-Pin packages (MSOP, PDIP, and SOIC) and is ideal for applications requiring small size and low power. It is, nonetheless, a critical technological pillar for advancing the field of heterogeneous chipset integration with reduced size and increased performance.
What Is SOIC Chip
SOIC stands for Small Outline Integrated Circuit, and it is a surface-mounting IC package. A flat rectangular body with leads protruding from two sides is the conventional form. The leads are shaped like gull wings to ensure a secure footing during installation to a PCB.
Figure 1: SOIC Chip
SOIC technology’s novel bonding strategy allows strong bonding pitch scaling for chip I/O to implement high-density die-to-die interconnects. The bond pitch begins with the sub-10 m rule.
Conclusion
SOIC 8 and SO 8 are simply various packages. And, more frequently than not, there is no distinction in the datasheet name. Sometimes drawing will mention the body type.
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